Wednesday, February 26, 2014

Repost, with Comments: Key Trends Driving the Global Packaging Market

http://www.packworld.com/trends-and-issues/global/revealing-key-trends-driving-global-packaging-market?utm_source=New_Issue_Alert&utm_medium=newsletter&utm_campaign=PW_NIA_2014-02-26%20(Actual)&spMailingID=8048300&spUserID=NzgwMDkzOTQ1OQS2&spJobID=122200754&spReportId=MTIyMjAwNzU0S0



http://campaigns.wonderware.com/campaigns/Pages/MES-flight2.aspx?utm_source=iom.com%2Fen&utm_medium=banner&utm_content=homepage_banner&utm_campaign=MES+F&B


This article by Packaging World reveals an uptick and growth in the opportunities for packaging.  We at Invensy|Schneider Electric have seen a growing interest in operations management solutions that can boost, improve and optimize packaging operations. Packagers need to ensure maximum uptime with minimal resource consumption--that means, no downtime, excessive energy usage, labor or materials. It's about providing solutions that integrate easily to the process, the controllers, and the applications used on the floor; provide fast ROI, and are scalable to multiple lines, sites, and locations.  If you are a packager, and are interested in how you can achieve more output, quality, and uptime--please visit: http://software.invensys.com/solutions/operations-management-and-mes/manufacturing-operations-management/

No comments:

Post a Comment