Repost, with Comments: Key Trends Driving the Global Packaging Market

http://www.packworld.com/trends-and-issues/global/revealing-key-trends-driving-global-packaging-market?utm_source=New_Issue_Alert&utm_medium=newsletter&utm_campaign=PW_NIA_2014-02-26%20(Actual)&spMailingID=8048300&spUserID=NzgwMDkzOTQ1OQS2&spJobID=122200754&spReportId=MTIyMjAwNzU0S0

This article by Packaging World reveals an uptick and growth in the opportunities for packaging.  We at Invensy|Schneider Electric have seen a growing interest in operations management solutions that can boost, improve and optimize packaging operations. Packagers need to ensure maximum uptime with minimal resource consumption--that means, no downtime, excessive energy usage, labor or materials. It's about providing solutions that integrate easily to the process, the controllers, and the applications used on the floor; provide fast ROI, and are scalable to multiple lines, sites, and locations.  If you are a packager, and are interested in how you can achieve more output, quality, and uptime--please visit: http://software.invensys.com/solutions/operations-management-and-mes/manufacturing-operations-management/

Invensys and Microsoft, Together Again at the LATAM CIO Leadership Forum 2013

From Sept 30 through October 3, 2013 Invensys joined Microsoft’s Latin America CIO Leadership Forum in Miami, FL.  This event was created for CIO’s from government, industry and education, and offered a full program for both peer networking and deep-dive presentations.

Covering key IT topics as the cloud, devices and apps, mobility, big data, the forum also featured a case study from HP, and product updates from their CRM, Office and ERP teams.

Building on the interest for big data, the cloud, and mobility, Invensys showed solutions for food and beverage and CPG, water/wastewater and oil and gas.

Invensys Solutions for Food and Beverage, CPG were shown at the CIO Summit, based on Microsoft's technology stack

Bill Schiel and Marcelo Zaremba discussed with attendees scalable solutions based on Wonderware MES, SCADA as well as Consulting and Services offerings.

Invensys' Marcelo Zaremba discusses manufacturing operations solutions with CIO

For CIO’s, key care-abouts are keeping up with the pace of technology that is occurring today.  The cloud offers opportunities for cost savings, scalability, and ubiquitous access to applications enterprise-wide, but it also brings with it needed policies for security and standardization.   Mobility and the “Bring Your Own Device” momentum challenge CIOs with creating policies for compliance and multi-platform support. And Big Data feeds the needs for better analysis, knowledge management and decision making, but CIO’s must face multiple data source consolidation/acquisition and visualization.

Microsoft and Invensys, together have created solutions that build on the base technologies of big data, mobility and cloud.  For more information, please visit http://iom.invensys.com/EN/Pages/IOM_PartnersMicrosoft.aspx and for our cloud solutions based on Azure,  http://global.wonderware.com/EN/Pages/InvensysCloudforManufacturing.aspx